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Thread: Thermaltake Toughpower DPS G 1050 W review @ TechPowerUp

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    I really like his pains-taking reviews.
    CPU: Core i7 8700k, HT enabled, all 6 cores OC'd to 4.8GHz, Vcore = 1.24v
    Heatsink: Noctua NH-D15 with one NF-A15 1500 RPM PWM fan
    Motherboard: Gigabyte Z370X Aorus Gaming 7
    RAM: 4x16GB (64GB) Corsair Vengeance LPX DDR4 RAM 16-18-18-36@3200MHz, Vdimm = 1.35v
    GPU: MSI GeForce GTX 1080 DirectX 12 with 8GB 256-Bit GDDR5X
    SSD1: Samsung 840 EVO 500GB TLC; SSD2: SAMSUNG 860 EVO 1TB 3-bit MLC
    HD: WD 500GB (old); Case: LIAN LI PC-7H Aluminum ATX Mid Tower
    PSU: Seasonic Platinum 660W

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    Quote Originally Posted by quest for silence View Post
    How much criticism: yet you and McSteel are usually so even-tempered!
    Was the original Sirfa-made DPS all that better than this new CWT one?
    No. That was part of the problem. Even Corsair pursued High Power about using their "DPS" platform, but it was never really ready for mass-production and nobody could seem to make much improvement without screwing something else up.

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    Quote Originally Posted by crmaris View Post
    Basically with a heatsink attached on them I believe that they could loosen up even more the fan profile.
    Where were the thermistors located again? Just on the PFC sink, right?

    Because I can say in the case of the HXi that the temperatures of the parts on the primary side would get far hotter than the secondary FETs. Put a heatsink and thermistor on there and, guess what? Nothing. When you program your fan controller to operate on a win/lose condition, the secondary side simply doesn't get hot enough to ramp up the fan. If you "loosen up" the fan profile more than it is, it's not the seconddary side that's going to overheat.... it's the primary side.

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    Quote Originally Posted by jonnyGURU View Post
    Where were the thermistors located again? Just on the PFC sink, right?

    Because I can say in the case of the HXi that the temperatures of the parts on the primary side would get far hotter than the secondary FETs. Put a heatsink and thermistor on there and, guess what? Nothing. When you program your fan controller to operate on a win/lose condition, the secondary side simply doesn't get hot enough to ramp up the fan. If you "loosen up" the fan profile more than it is, it's not the secondary side that's going to overheat.... it's the primary side.
    Did the PSU engineers run the tests as you specified? Or did they send yo some samples to test? Or did you all travel to China? It's hard for me to imagine your sitting at home, trying to PM an engineering intensive device like a PSU.
    CPU: Core i7 8700k, HT enabled, all 6 cores OC'd to 4.8GHz, Vcore = 1.24v
    Heatsink: Noctua NH-D15 with one NF-A15 1500 RPM PWM fan
    Motherboard: Gigabyte Z370X Aorus Gaming 7
    RAM: 4x16GB (64GB) Corsair Vengeance LPX DDR4 RAM 16-18-18-36@3200MHz, Vdimm = 1.35v
    GPU: MSI GeForce GTX 1080 DirectX 12 with 8GB 256-Bit GDDR5X
    SSD1: Samsung 840 EVO 500GB TLC; SSD2: SAMSUNG 860 EVO 1TB 3-bit MLC
    HD: WD 500GB (old); Case: LIAN LI PC-7H Aluminum ATX Mid Tower
    PSU: Seasonic Platinum 660W

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    Quote Originally Posted by ehume View Post
    Did the PSU engineers run the tests as you specified?
    Not as >>I<< specified.. but as the PRD written by Corsair's engineers specified.

    Quote Originally Posted by ehume View Post
    Or did you all travel to China?
    Corsair has two PSU engineers in the U.S. that alternate trips to China (three weeks there, three weeks back). There's also a Corsair QC and validation team in Taiwan, China and the U.S. that run products through different tests once the product is in EVT stage (everything from thermal to drop tests). Those guys find all sorts of crazy shit. Like finding out that the Mylar sheet used between the PCB and the PSU housing on the HX1200i didn't meet the thermal specifications laid out in Corsair's PRD. TBH: I know I would've totally missed something like that.

    Quote Originally Posted by ehume View Post
    It's hard for me to imagine your sitting at home, trying to PM an engineering intensive device like a PSU.
    Maybe because I'm not a PM.

    My job at Corsair has little to nothing to do with developing PSU product... or any product for that matter. I just support product after the fact. We write blogs, reviewer's guides, proof manuals, answer questions for tech support and the press, support the forums, etc. But I am very close with Corsair's engineers on a non-official capacity and like to question every decision they make during the development cycle (like not putting sinks on the secondary FETs) and try to drop in on as many PSU meetings as possible. But that's more of a "hobby" thing for me given my background than a requirement of my job.

    Sometimes I feel like I'm pissing them off because "it's not my job", but other times I think they actually like talking shop so much that they don't mind at all. Nothing like getting sucked into a conversation about the advantages of Gallium Nitride over Silicon Carbide to make your morning a little more interesting.

  7. The Following 3 Users Say Thank You to Jon Gerow For This Useful Post:

    C'DaleRider (11-10-2014), ehume (11-08-2014), Philipus II (11-08-2014)

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